Schmid’s Rettenmeier to speak at ECTC on panel-level glass-core packaging platform
PUBT · 04/30 09:39
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- Schmid Group Chief Sales Officer Roland Rettenmeier will speak at ECTC 2026 in May 2026 in Orlando, Florida.
- Talk titled “InfinityBoard - A Panel-Level Glass-Core Packaging Platform for Ultra-Fine RDL and Vertical Interconnect Integration” will outline Schmid’s panel-level glass-core packaging strategy.
Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schmid Group NV published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202604300539PRIMZONEFULLFEED1001179116) on April 30, 2026, and is solely responsible for the information contained therein.
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