The 2026 World Artificial Intelligence Conference will be held in Shanghai from July 17 to 20, and more than 300 products are expected to debut globally. Huawei will be showcasing the latest supernode product, the Atlas 950 SuperPod, and the world's most powerful supernode cluster, the Atlas 950 SuperCluster. Shanghai Oriental Computing Technology Co., Ltd. will launch the DF1000, the world's first software-defined near-memory computing 3D chip. Tianwu Technology will be showcasing innovative technology products that use AI technology to turn waste plastics back into textile raw materials. Shanghai Weizhi Technology Group will present the first multi-modal spatio-temporal basic model for urban space.

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