Zhitong Finance App News, Huike Co., Ltd. (001399.SZ) announced that on July 17, 2026, the company signed a “Cooperation Agreement” with the Hangzhou Airport Economic Integration Development Demonstration Zone Shaoxing Area Management Committee to carry out Huike's advanced packaging and testing project. The company plans to invest 4 billion yuan to establish a wholly-owned subsidiary Zhejiang Huixin Advanced Semiconductor Co., Ltd. (tentative name) as the project implementer. The project is being built in two phases. Among them, the first phase of the project plans to build advanced packaging and testing of 12-inch hybrid chips. After delivery, the production capacity will reach 20 million units/month. The construction period of the project is expected to be no more than three years.

Against the backdrop of the restructuring of the global semiconductor industry supply chain and the continuous growth in demand in the domestic chip packaging and testing market, the company's entry into the field of advanced packaging and testing through this investment is an important step for the company to actively extend to high added value links in the industrial chain. It is conducive to cultivating new business growth poles, optimizing the industrial structure, and enhancing the company's overall competitiveness and long-term profitability.

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