According to the CITIC Construction Investment Research Report, photosensitive dry film is one of the core consumables for PCB circuit graphics transfer. Currently, global PCBs and packaging substrates have entered a structural growth cycle driven by AI servers, data centers, and high-speed network equipment. We expect the 2026-2030 photosensitive dry film market space to be 95/104/113/124/13.6 billion yuan, respectively, corresponding to a CAGR of about 9.4% for 2025-30. Currently, the global photosensitive dry film is mainly dominated by companies in Taiwan and Japan. Since leading PCB companies have begun to use domestic photosensitive dry film in batches, and downstream PCB production capacity is concentrated in China, it is expected that the domestic market share of photosensitive dry film will continue to increase.

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