According to Zhitong Finance App, Shenwan Hongyuan (06806) issued an announcement. On July 20, 2026, Shenwan Hongyuan Securities Co., Ltd. publicly issued subprime bonds (the first installment) (hereinafter referred to as “current bonds”) to professional investors in 2026 to complete the issuance process. The issuance scale of the current bond is RMB 3 billion, with a term of 5 years, and a coupon interest rate of 1.89%. The current bond will be listed and traded on the Shenzhen Stock Exchange after registration is completed.

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