• Soitec entered a strategic collaboration with ZenSemi to enable high-volume production of 300 mm BCD-on-SOI technology for next-generation power electronics.
• Soitec will supply ZenSemi with 300 mm Power-SOI substrates to support development and ramp-up of a new BCD-on-SOI process.
• Partnership targets applications including AI data centers, electric vehicles, humanoid robots, industrial systems.
• Collaboration supports the industry shift to higher power-density, more reliable chip architectures for power distribution and battery management systems.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Soitec SA published the original content used to generate this news brief on July 22, 2026, and is solely responsible for the information contained therein.