• Schneider Electric entered a collaboration with AMD to co-develop a validated reference design for AMD’s Helios rackscale AI platform.
• Reference design targets faster rollout of high-density AI “factory” data centers, aiming to cut integration risk across power, cooling, IT layout.
• Blueprint supports racks up to 246 kW, modular AI clusters up to 10.4 MW IT load, aiming for PUE near 1.12 at full load.
• Design centers on liquid cooling, using CDU-based systems, targeting removal of up to 84% of heat from high-density AI deployments.
• Initial framework validated to US ANSI standards, with plans to extend to IEC standards for broader global deployment.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Schneider Electric SE published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202607231500OMX_____CNEWS_EN_GNW9767282_en) on July 23, 2026, and is solely responsible for the information contained therein.