• Amkor entered a $1.5 billion multi-year advanced packaging and development agreement with Nvidia, backed by an Nvidia prepayment.
• Deal supports expansion of U.S. advanced packaging capacity in Arizona to meet demand for next-generation AI infrastructure.
• Partnership targets advanced packaging and test technologies, including high-density interconnects and heterogeneous integration.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Amkor Technology Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 202607231700BIZWIRE_USPR_____20260723_BW873230) on July 23, 2026, and is solely responsible for the information contained therein.