On July 24, the groundbreaking ceremony for the Shenzhen Third Park of Pengding Holdings was held in Yanluo Street, Bao'an District, Shenzhen. The Shenzhen Third Park project plans to invest 10 billion yuan to build a modern high-end printed circuit board production base integrating R&D innovation, intelligent manufacturing, digital operation, and green and low carbon. The project will focus on products such as high-end carrier boards for AI servers, high-end HDI, and advanced flexible circuit boards for AI terminals.

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