Zhitong Finance App News, Lansi Technology (06613) announced that Lansi International (Hong Kong) Limited (Lansi International), a wholly-owned subsidiary of the company, recently signed a memorandum of cooperation with Intel Corporation (stock code: NASDAQ: INTC) (Intel).
According to the Memorandum of Understanding, the two sides regard TGV advanced packaging as the key direction of discussions under this Memorandum, and Intel sees Lansi International as a valuable potential partner in this field. The two sides will discuss and evaluate potential collaborations related to key processes such as glass substrate drilling, high-precision laser processing, metallized through-hole deposition, and multi-layer interconnect wiring, and Intel will provide illustrative architecture information, manufacturability design (DFM) guidelines, benchmark testing methods, and verification methods. Each of the above requires a separate written agreement, and any engineering verification, certification, or mass production activity shall be defined and bound by a separate written agreement.
In addition to TGV, the two sides believe there is also meaningful exploration potential in other fields with complementary advantages, such as AIPC structural parts and modules, high-reliability structural parts and cooling components for data center servers, and embedded intelligent robots, industrial intelligent devices, and edge computing hardware. The parties will discuss the above opportunities as they arise, and any such cooperation (if any) will proceed under a separate written agreement.
According to the announcement, the company has long-term technical accumulation in processes such as TGV precision machining, microporous molding, metallization and multi-layer interconnection. It has built relevant pilot lines and carried out sample trial production. Currently, it has sent samples for evaluation to some potential customers, and some customers have passed preliminary concept verification and entered the technical testing stage.
The Board believes that the memorandum of understanding will help the company establish a long-term, stable, and mutually trusting strategic partnership with Intel. By leveraging the strong professional strength and operational capabilities of both parties in their respective fields (including precision manufacturing, materials science and global supply chain management), this cooperation is expected to promote large-scale application of relevant new technologies as soon as possible and promote the achievement of the company's medium- to long-term strategic goals.