According to the Zhitong Finance App, Lansi Technology (300433.SZ) announced that Lansi International (Hong Kong) Co., Ltd., a wholly-owned subsidiary of the company, recently signed a memorandum of cooperation with Intel Corporation (hereinafter referred to as “Intel”). The two sides regard TGV advanced packaging as the key direction of discussions under this Memorandum of Understanding, and Intel sees Lansi Technology as a valuable potential partner in this field. The two sides will discuss and evaluate potential collaborations related to key processes such as glass substrate drilling, high-precision laser processing, metallized through-hole deposition, and multi-layer interconnect wiring, and Intel will provide illustrative architecture information, manufacturability design (DFM) guidelines, benchmark testing methods, and verification methods.
In addition to TGV, the two sides believe there is also meaningful exploration potential in other fields with complementary advantages, such as AIPC structural parts and modules, high-reliability structural parts and cooling components for data center servers, and embedded intelligent robots, industrial intelligent devices, and edge computing hardware. The parties will discuss the above opportunities as they arise, and any such cooperation (if any) will proceed under a separate written agreement.
The company has long-term technical accumulation in processes such as TGV precision machining, microporous molding, metallization and multi-layer interconnection. It has built relevant pilot lines and carried out sample trial production. Currently, it has sent samples for evaluation to some potential customers, and some customers have passed preliminary concept verification and entered the technical testing stage.
The signing of the Memorandum of Understanding will help the company establish a long-term, stable and mutually trusting strategic partnership with Intel. All parties have strong professional strength and operational capabilities in their respective fields (including precision manufacturing, materials science and global supply chain management), promote large-scale application of relevant new technologies as soon as possible, and promote the achievement of the company's medium- to long-term strategic goals.