The Zhitong Finance App learned that Citi released a research report saying that Lansi Technology (06613.HK) announced that it has signed a technical cooperation memorandum with Intel (INTC.US) for advanced glass through-hole packaging to evaluate potential cooperation in key processes such as glass substrate perforation molding, high-precision laser processing, metallized through hole deposition, and multi-layer interconnect wiring. Citi expects Lansi to go through several certification processes this year. Customers may launch related products next year to maintain their “buy” rating. The target price for H shares is HK$25.

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