According to Zhitong Finance App, Shenwan Hongyuan (06806) announced that Shenwan Hongyuan Securities Co., Ltd., a subsidiary of the company, completed the public issuance of subprime bonds (first instalment) (hereinafter referred to as “current bonds”) to professional investors in 2026 on July 20, 2026. The issuance scale of the current bond is RMB 3 billion, with a term of 5 years, and a coupon interest rate of 1.89%.

After review by the Shenzhen Stock Exchange, the current bond is scheduled to be listed on the Shenzhen Stock Exchange from July 27, 2026, and traded to institutional investors among professional investors. The bond is abbreviated as “26 Declaration C1”, and the bond code is “524918.”

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