The two leading companies in the electronics industry chain have successively disclosed major investment plans. Both projects have settled in Shenzhen, with a total planned investment scale of over 20 billion yuan, targeting the two major high-growth tracks for AI server circuit boards and large-size semiconductor silicon wafers, respectively. Zhending Technology Group held a groundbreaking ceremony for the third park of Pengding Holdings in Bao'an, Shenzhen. The project was invested by Pengding Holdings (Shenzhen) Co., Ltd., a core listed entity under Zhending Technology Group, with a total investment of over 10 billion yuan. It will build an intelligent manufacturing base for advanced AI carrier boards and flexible circuit boards. TCL Zhonghuan announced that it plans to invest in the construction of the “Shenzhen Project for Large Semiconductor Wafers for Integrated Circuits” with the holding subsidiary Shenzhen Zhonghuan Leading, as the main body. The total investment is estimated to be about 11.96 billion yuan.

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