Key Highlights

• Certified AI-powered EDA flows and multiphysics analysis for Intel 14A designs: Provide early insight into power integrity, thermal, and electromagnetic effects, improving predictability and accelerating convergence
• From DTCO to system-aware co-optimization: Extends co-optimization across silicon, package, IP and system domains to enable full system realization with optimal PPA
• Multi-die and advanced packaging leadership: Synopsys 3DIC Compiler platform extends exploration-to-signoff support to designs integrated with Intel EMIB and Intel EMIB-T, enabling multi-die designs
• Broad IP portfolio for faster time-to-tapeout: Interface and Foundation IP for Intel 14A — including PCIe 7.0, 224G SerDes, USB 4 and eUSB reduce integration risk and accelerate design readiness

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