Over the past few months, large technology companies and large technology companies have poured into the bond market and issued large-scale bonds; at first, investors eager to take advantage of the AI boom were scrambling to buy them. But as demand weakens and concerns about the bubble increase, such deals are now more difficult to complete and more expensive to finance. BlackRock issued a $12.5 billion bond on Monday, yielding a yield of 7.53%. According to the data, this is one of the highest-yielding blue-chip data center bond issues since the AI financing boom began last year. Since 2025, the scale of global AI-related debt financing has surpassed $570 billion, and borrowing costs have soared. At a time when more deals are queuing up, this boom has pushed the credit market to the limit, and has also triggered banks and other institutions to seek to hedge against the risk that investments will never be rewarded.

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