On the morning of July 30, the signing ceremony for the HITS advanced packaging R&D industrialization project under Huicheng Co., Ltd. was held in Shanghai. According to reports, Huicheng Co., Ltd. chose its location in Nanxiang Town, Jiading District, Shanghai, with an estimated total investment of not less than 7.5 billion yuan to officially operate the HITS advanced packaging process platform and R&D headquarters. The project will focus on five key technical bottlenecks in the field of advanced packaging, including ultra-narrow pitch bump bonding and ultra-fine line interconnect high-speed chips.
Zhitongcaijing · 2d ago
Share
Listen to the news
On the morning of July 30, the signing ceremony for the HITS advanced packaging R&D industrialization project under Huicheng Co., Ltd. was held in Shanghai. According to reports, Huicheng Co., Ltd. chose its location in Nanxiang Town, Jiading District, Shanghai, with an estimated total investment of not less than 7.5 billion yuan to officially operate the HITS advanced packaging process platform and R&D headquarters. The project will focus on five key technical bottlenecks in the field of advanced packaging, including ultra-narrow pitch bump bonding and ultra-fine line interconnect high-speed chips.
Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.
What's Trending