Chippeng announced that the first issue of the company's 2026 science and technology innovation bonds has been issued, with a total amount of 600 million yuan. The funds raised have been fully paid on July 31, 2026. The bond is “26 Chippeng MTN001” for short. The code is 102682858, the term is 1+1 year, the interest rate is July 31, 2026, the payment date is July 31, 2028, and the issuance interest rate is 1.60%. It is underwritten by the Bank of Ningbo.

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