• ACM Research expanded its Ultra C Tahoe system into a multi-process wet processing platform for advanced logic and memory manufacturing.
• Platform combines batch and single-wafer wet processes in one architecture, aiming to cut wafer transfers, shorten cycle times, improve throughput.
• Multiple leading chipmakers have adopted the expanded platform, signaling production readiness for advanced-node wet processing.
• Added monitor-wafer reclaim capability now running in volume production, consolidating film removal, cleaning, drying on one tool.
• Company cited up to 75% lower sulfuric acid use, targeting cost reduction and lower chemical waste.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. ACM Research Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202608070500PRIMZONEFULLFEED9805887) on August 07, 2026, and is solely responsible for the information contained therein.