According to the CICC research report, China's PCB industry has accelerated development in recent years, providing opportunities for domestic enterprises to develop the dry film manufacturing industry. Dry film technology barriers are high, superposition demand continues to grow, and it has long-term investment value. It is estimated that the market size of the photosensitive dry film market in 2026 is about US$2,333 billion, and is expected to reach US$3.348 billion by 2030, or 9.44% CAGR. According to Prismark data, the global PCB market size will reach 85.8 billion US dollars in 2025, +16.7% year over year; this year it is expected to reach 102 billion US dollars, +19% year over year. Prismark expects the market size to be about 144.6 billion US dollars in 2030. The AI field is growing rapidly, and demand for high-end PCB boards such as multilayer boards/HDI/packaging substrates is growing rapidly. We expect the dry film market size corresponding to multi-layer boards/HDI/packaging substrates to increase by 45.2%/50.6%/54.4% in 2030 compared to 2026, respectively.

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