According to Youzu Network, on August 12, Youzu Network reached a cooperation with Kangying Semiconductor and Xiwang Sunrise to jointly launch the “2.5D/3D Advanced Packaging Center” in the Wuxi High-tech Zone. The core goal of the project is to build a Cowos-L full-stack process mass production OEM service platform. It aims to break through innovative breakthroughs in back-end processes, break overseas technology monopolies, and inject new momentum into the autonomy and control of China's semiconductor industry chain. According to the plan, the “2.5D/3D Advanced Packaging Center” will be built in three phases. After full completion, it will form a complete advanced packaging system covering key technologies such as bump technology, wafer-level packaging, fan-out packaging, and 2.5D/3D heterogeneous integration.

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