Industry sources revealed on Wednesday that SK Hynix will hold an official groundbreaking ceremony for its new semiconductor packaging plant in Indiana, USA on August 27. The South Korean chip maker has announced plans to invest $3.87 billion in the US's first advanced packaging R&D site in West Lafayette, Indiana to produce high-bandwidth memory chips for artificial intelligence.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.