• HUHUTECH’s Japan unit won a competitive RFP for a tool hook-up program at a Hiroshima semiconductor plant covering fiscal 2027-2028.
• Scope includes electrical hook-up work, heating-jacket installation, materials, labor under a statement of work.
• Work will be issued via purchase orders with no minimum volume or value commitment.
• Customer previously awarded HUHUTECH a vacuum pipeline insulation project worth about USD 0.6 million in June 2026.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. HUHUTECH International Group Inc. published the original content used to generate this news brief via GlobeNewswire (Ref. ID: 202608200900PRIMZONEFULLFEED9813437) on August 20, 2026, and is solely responsible for the information contained therein.