Caitong Securities released a research report saying that Taow's Law technology will soon be implemented, and Kirin 2026 will restructure the chip's energy efficiency ceiling, making a double leap forward in computing power and energy efficiency. Semiconductor equipment, which is the core strengthening link, has become the core pillar and development focus of Tao Dingyu's implementation; heat dissipation has become a card point for whether the Tao Dingyu route can continue to be stacked and expanded to three or four layers of computing power chips. It is recommended to focus on semiconductor equipment opportunities corresponding to core incremental process links brought about by the implementation of Tao's law technology and growth opportunities under the sharp increase in cooling demand brought about by Tao's law.

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