• Northrop Grumman won a USD 7 million DARPA THREADS Phase 2 contract to develop diamond-cooled microchips for military radar, communications.
• Program targets higher power density for RF electronics by embedding diamond heat-dissipation structures directly into chip architectures.
• Phase 2 objective calls for tripling power density versus Phase 1, following a 3.3x power increase achieved in earlier testing.

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