According to USI Electronics, Guangchuanglian, a wholly-owned subsidiary of USI Electronics, officially released product lines such as UHP ELSFP external light source modules. NPO and CPO technologies are inevitable trends in next-generation AI intelligent computing clusters, supercomputing centers, and high-density data centers. Among them, ELSFP is a pluggable external laser source, physically isolating the high heat sensitive laser from the core electronic chip. On the one hand, it solves the power wall and heat dissipation problems of traditional pluggable optical modules at ultra-high speed rates; on the other hand, it supports hot pluggable functions, greatly reducing low data center operation and maintenance costs and the risk of business interruption. It is a key supporting component of the next generation of hyperscale data center 51.2T/102.4T NPO/CPO switches, high-performance computing interconnect networks, and the Spine/Core layer of cloud data centers. Guangchuanglian ELSFP VPH and UPH series product engineering prototypes were completed from the fourth quarter of 2025 to the second quarter of 2026; trial production is scheduled to advance from the third quarter to the fourth quarter of 2026; mass production is expected to be achieved in the first quarter of 2027.

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