• Qualcomm transcript from the Deutsche Bank 2026 Technology Conference, featuring EVP and GM Durga Malladi in a fireside chat with analyst Amy Sutter.
• Malladi framed high-bandwidth compute (HBC) as a compute-plus-memory co-design to address an AI “memory wall,” positioned as an alternative to HBM.
• He cited 6x better tokens-per-watt versus HBM, with bandwidth in the hundreds of terabytes per second; SRAM seen as costly on area and racks.
• Gen 1 HBC slated to ship commercially in 2027, Gen 2 in 2028; silicon has returned to labs, with validation data expected next quarter.
• He described active hyperscaler talks with mix-and-match adoption of HBC, CPUs, accelerators, or custom silicon; HBC aimed at decode, not prefill.

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