On August 28, Panasonic Mechatronics issued a notice on August 6 stating that it will adjust the price of electronic circuit board materials. Shipment of products will begin to be implemented on September 1, 2026, with an increase of up to 30% for some products. According to information, this price adjustment involves various types of electronic circuit board materials such as copper-clad sheets and semi-cured sheets. Among them, the price of copper-clad plates and semi-cured sheets of ordinary multi-layer board materials increased by 30%; the price of copper clad plates and semi-cured sheets of MEGTRON and XPEDION low-loss materials both increased 15%; and the price of copper clad plates and semi-cured sheets of LEXCM GX semiconductor carrier board materials increased by 30%. In addition, the price of CEM-3 glass composite substrate materials increased by 30%, and the price of FCCL flexible substrate materials increased by 15%. Semi-cured sheets are downstream semi-finished products of electronic cloth. They are made of electronic-grade glass fiber cloth impregnated resin, and are an important basic material for copper-clad boards and multi-layer PCBs.

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