On August 30, the Liancun Instruments global headquarters project with a total investment of 2 billion yuan began in the Suzhou High-tech Zone. After completion, the project will become the largest high-speed chip testing, R&D and production base in China. The project has a total land area of 97.55 acres and a total construction area of about 200,000 square meters. It integrates functions such as headquarters operation, high-end R&D, and industrial trial production. Suzhou Lianxun Instrument Co., Ltd., which landed on the Science and Technology Innovation Board in April of this year, is mainly engaged in R&D and manufacturing of test equipment for high-speed communication testing, optical chip testing, and third-generation semiconductor power chips and memory chips. It is the second manufacturer in the world that can provide a full set of core test instruments for 1.6T optical modules. Its performance increased significantly in the first half of this year.

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