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BYD Semiconductor announced today that a 4D millimeter-wave radar chip with a next-generation satellite architecture using Xuanji A3 as the computing power center has been mass-produced. Based on the 28nm vehicle specification process, the chip is specially designed to meet the automotive market's demand for high-resolution radar systems, and can seamlessly connect with many mainstream smart driving chip platforms. At the same time, the chip has completed joint adaptation with the “Xuanji A3” smart driving chip to meet the detection performance requirements of Tier 1 module manufacturers. The solution based on this chip can fully cover L2-L4 intelligent driving applications, including high-speed piloting, urban road driving, automatic parking, blind spot monitoring, etc.
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BYD Semiconductor announced today that a 4D millimeter-wave radar chip with a next-generation satellite architecture using Xuanji A3 as the computing power center has been mass-produced. Based on the 28nm vehicle specification process, the chip is specially designed to meet the automotive market's demand for high-resolution radar systems, and can seamlessly connect with many mainstream smart driving chip platforms. At the same time, the chip has completed joint adaptation with the “Xuanji A3” smart driving chip to meet the detection performance requirements of Tier 1 module manufacturers. The solution based on this chip can fully cover L2-L4 intelligent driving applications, including high-speed piloting, urban road driving, automatic parking, blind spot monitoring, etc.
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