• Hua Hong Grace signed agreements to form Wuxi JV III, a $4.17 billion equity-funded joint venture for a 12-inch wafer fab.
• Project targets about 55,000 wafers per month, expanding capacity in mainland China’s foundry market.
• Equity commitments: $1.04 billion from the company, $1.08 billion from HHGrace Shanghai, $834 million from Wuxi Municipal Entity II.
• Hua Xin Fund will invest $625.5 million; CDB Entity will invest $583.8 million, taking combined stakes of 15% and 14%.
• Group will hold about 51% post-closing; CDB Entity receives a redemption right requiring HHGrace Shanghai to buy its stake on request.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Hua Hong Grace Semiconductor Ltd. published the original content used to generate this news brief via IIS, the regulatory disclosure system operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260901-12314371), on September 01, 2026, and is solely responsible for the information contained therein.