• SUSS MicroTec entered a strategic collaboration with Manz Asia to develop next-generation inkjet solutions for semiconductor manufacturing.
• Partnership targets advanced packaging, with a focus on accelerating product development and shortening time to market for new inkjet tools.
• Deal expands access to panel-level packaging, leveraging Manz Asia’s position in that ecosystem to support scale-up.
• SUSS expects inkjet to become a larger part of its coating business; it estimates the addressable market could exceed USD 800 million by 2030.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Süss MicroTec SE published the original content used to generate this news brief via EQS News (Ref. ID: corporate_2392868_de) on September 03, 2026, and is solely responsible for the information contained therein.