• Manz Asia agreed a strategic collaboration with SUSS to develop next-generation inkjet tools for semiconductor manufacturing and advanced packaging.
• Partnership targets panel-level packaging, aiming to speed inkjet adoption in high-volume production through joint application, material, and process development.
• Manz Asia contributes inkjet platforms and manufacturing engineering; SUSS provides semiconductor process expertise and global customer access.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Manz AG published the original content used to generate this news brief via PR Newswire (Ref. ID: 202609030330PR_NEWS_USPR_____HK40030) on September 03, 2026, and is solely responsible for the information contained therein.