According to the Zhitong Finance App, China Tongfu (01763.HK) announced that China Tongfu Co., Ltd. will publicly issue science and technology innovation company bonds to professional investors in 2026 (including 500 million yuan) on an issuance scale of no more than RMB 500 million (including 500 million yuan). The issuance of the current bond was completed on September 7, 2026. The actual issuance scale of the current bond (abbreviation: 26 Tongzhu K1, code: 246015) was 500 million yuan, the final coupon interest rate was 1.50%, and the subscription ratio was 5.86 times.

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