On September 8, Dutch lithography machine manufacturer Asmack and TSMC announced the establishment of an industry cooperation plan to promote the upgrade of high-numerical aperture extreme UV lithography masks from the current 6 inch to 12 inch to improve fab production efficiency, reduce chip manufacturing costs, and eliminate splicing restrictions. The two sides plan to establish a 12-inch mask trial production line in 2031 and push the 12-inch high-NA EUV lithography system into mass production with advanced manufacturing processes in 2033. TSMC expects to use ASML high NA technology in large-scale production of advanced processes starting in 2030.

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