• Intel partnered with ASML to accelerate production readiness for High NA EUV lithography.
• More than 1,000,000 wafers have been processed using High NA across tool certification, R&D, and select high-volume layers for Panther Lake.
• Intel 18A chips using High NA on select layers met or exceeded performance versus comparable layers patterned on ASML’s 0.33 NA NXE EUV tools.
• The companies are aligning the ecosystem for a shift from 6-inch masks to 6x12-inch masks, with stitching to support current masks.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Intel Corporation published the original content used to generate this news brief via Business Wire (Ref. ID: 20260907972389) on September 08, 2026, and is solely responsible for the information contained therein.