03:38 AM EDT, 09/08/2026 (MT Newswires) -- Semiconductor equipment maker ASML Holding (ASML.AS) partnered with Taiwan Semiconductor Manufacturing Co., d/b/a TSMC, and Samsung Electronics (SMSN.L) on larger-format extreme ultraviolet lithography photomasks, according to separate releases on Tuesday. ASML and TSMC aim to drive the transition to 12-inch photomasks, which are expected to increase fab productivity, lower chipmaking costs, and remove stitching constraints, enabling manufacturers to better leverage High NA EUV technology. The initiative intends to establish a 12-inch mask pilot line by 2031, paving the way for 12-inch High NA lithography systems to enter advanced-node production by 2033. Samsung plans to introduce ASML's High NA lithography into future DRAM high-volume manufacturing by 2028, while TSMC intends to use the technology in high-volume manufacturing for advanced nodes starting in 2030.

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