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At the 27th China International Optoelectronics Fair, the chip-level optical interconnection company OptoLink Silicon launched the world's first micro-ring wafer wavelength editing equipment — the “minimal” series ZW1000 silicon optical maskless programmable lithography machine. The ZW1000 lithography machine uses an opto-mechatronic architecture, which combines the first two major systems of maskless high-speed accurate projection and high-precision laser annealing. For a complete 12-inch wafer, the entire inspection, repair, and verification process takes only 5 hours. The microring wavelength consistency of the entire wafer has been significantly improved, and the yield has increased to 99%. The device supports various communication protocol standards to customize target wavelengths, which is equivalent to giving the silicon chip “programmable” ability before leaving the factory. The mass production application of this equipment has filled the gap of “high-throughput repair equipment” in the industrialization of microring chips and diluted the manufacturing cost of a single chip.
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At the 27th China International Optoelectronics Fair, the chip-level optical interconnection company OptoLink Silicon launched the world's first micro-ring wafer wavelength editing equipment — the “minimal” series ZW1000 silicon optical maskless programmable lithography machine. The ZW1000 lithography machine uses an opto-mechatronic architecture, which combines the first two major systems of maskless high-speed accurate projection and high-precision laser annealing. For a complete 12-inch wafer, the entire inspection, repair, and verification process takes only 5 hours. The microring wavelength consistency of the entire wafer has been significantly improved, and the yield has increased to 99%. The device supports various communication protocol standards to customize target wavelengths, which is equivalent to giving the silicon chip “programmable” ability before leaving the factory. The mass production application of this equipment has filled the gap of “high-throughput repair equipment” in the industrialization of microring chips and diluted the manufacturing cost of a single chip.
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