On September 15, according to reports, TSMC, Bosch, Infineon and NXP formed a joint venture to establish a European semiconductor manufacturing company, and today a factory capping ceremony was held in Dresden, Germany. OSMC broke ground in August 2024, and completed the main plant project after about 2 years of construction. OSMC President Kei District said that the next important milestone is the installation of the first process equipment in the second half of 2027. Dust-free interiors, automated wafer transportation systems, and production infrastructure such as electricity, water, gas and chemicals must still be completed before production is officially put into operation. As the construction of the plant progresses smoothly, it is estimated that 15,000 to 20,000 new workers will move into the region by 2030, including about 600 TSMC engineers and their families who will go to Germany next year, as well as TSMC suppliers and equipment vendors.

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