According to TrendForce Jibang Consulting's latest semiconductor advanced packaging industry research, as GPU manufacturers and large-scale cloud service providers continue to develop more powerful and multi-functional AI chips, one development focus of 2.5D packaging technology is to expand the package area. Among them, despite facing competition from InteleMiB-T, TSMCCowos-L is expected to remain the mainstream packaging solution for AI chips until 2028 due to its technical maturity and yield advantages.

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