• Lumentum plans a joint ECOC 2026 demonstration with Qualcomm Technologies, Corning on high-density optical die-to-die connectivity for AI scale-up.
• Board-level showcase targets co-packaged optics, near-packaged optics using emerging interfaces such as UCIe over multimode fiber spanning tens of meters.
• Proof-of-concept uses 32 Gb/s NRZ optical channels; design targets about 1 Tb/s/mm shoreline bandwidth density, scaling toward about 4 Tb/s/mm.
• Lumentum contributes a 1060 nm VCSEL optical engine with about 10 Tb/s aggregate transmit-receive capacity, using dense VCSEL-photodetector arrays.
• Corning supplies high-density multimode fiber glass ferrules; Qualcomm provides the die-to-die interface IP subsystem for direct-drive optical connectivity.

Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Lumentum Holdings Inc. published the original content used to generate this news brief via Business Wire (Ref. ID: 202609210507BIZWIRE_USPR_____20260921_BW397053) on September 21, 2026, and is solely responsible for the information contained therein.