The Zhitong Finance App learned that Lumentum (LITE.US) announced a plan jointly demonstrated with Qualcomm (QCOM.US) and Corning (GLW.US) on Monday at ECOC 2026, which will showcase high-density die-to-die (die-to-die) optical interconnection for AI horizontal scaling (scale-up) architectures.
This board-level demonstration will integrate Qualcomm's D2D interface IP subsystem, Lumentum (LITE) VCSEL-based optical interconnect platform, and Corning's multimode fiber connectivity.
In pre-market trading, Corning (GLW) rose 3%, Lumentum (LITE) rose 2.4%, and Qualcomm (QCOM) rose 1.3%.
The three companies said in a statement, “This demonstration will showcase a massively parallel optical D2D architecture designed for future co-packaged optics (CPO) and near-package optics (NPO) implementations, supporting emerging D2D interfaces such as UCiE.”
By extending high-density D2D connections to optical links spanning tens of meters — while maintaining low latency and low power consumption — the architecture can achieve highly scalable bandwidth density, as AI systems are driving interconnection requirements beyond the actual limits of today's electrical connections, the statement said.
Corning's multi-mode fiber-glass fiber connectors (ferrules) will provide the high-density fiber connections used in the demonstration, highlighting the importance of fiber density as optical links increasingly approach computing devices and advanced packaging environments.
Matt Sysak, chief technology officer at Lumentum (LITE), said, “This demonstration shows how Lumentum's 1060 nm VCSEL platform can connect high-density optical closer to AI computing.”