According to industry sources, Samsung plans to increase the amount of outsourced cleaning of glass carriers in the HBM process from 20,000 pieces per month this year to 50,000 tablets per month next year, a fivefold increase from 10,000 tablets per month last year. The glass carrier is a support structure temporarily installed at the bottom of the DRAM wafer in the HBM process to prevent the wafer from bending or cracking during etching and drilling. Since glass carriers can be reused, actual usage is affected by feeding methods and process yield, but if cleaning demand increases 2.5 times, it is likely that Samsung's HBM4 series production will at least double next year. Samsung is actively preparing to expand HBM4 and HBM4E production capacity. Both products use a high-stacking structure with 12 or more layers.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.