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According to the “Beijing Yizhuang” official account, recently, the 2026 Beijing Microelectronics International Conference and IC World Conference - Optoelectronic Integration Frontier Technology Forum was held in Yizhuang, Beijing. At the event site, the Beijing Key Laboratory for High-speed Optical Interconnection and Computing Technology was unveiled, and a municipal key laboratory was added in the field of integrated circuits in Yizhuang, Beijing. The Beijing Key Laboratory for High-speed Optical Interconnection and Computing Technology, which was unveiled this time, was jointly built by North Integrated Circuit Technology Innovation Center Co., Ltd., Beijing Haiguang Xincheng Semiconductor Technology Co., Ltd., Qiming Photonics Technology Co., Ltd. and Peking University, and has been officially licensed by the Beijing Municipal Science and Technology Commission and the Zhongguancun Management Committee. The laboratory will focus on building a “device-chip-system-package” full-chain R&D system focusing on the three core technology directions of heterogeneous integrated silicon optical chips, on-chip intensive wave-division multiplexing, and silicon optical advanced packaging.
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According to the “Beijing Yizhuang” official account, recently, the 2026 Beijing Microelectronics International Conference and IC World Conference - Optoelectronic Integration Frontier Technology Forum was held in Yizhuang, Beijing. At the event site, the Beijing Key Laboratory for High-speed Optical Interconnection and Computing Technology was unveiled, and a municipal key laboratory was added in the field of integrated circuits in Yizhuang, Beijing. The Beijing Key Laboratory for High-speed Optical Interconnection and Computing Technology, which was unveiled this time, was jointly built by North Integrated Circuit Technology Innovation Center Co., Ltd., Beijing Haiguang Xincheng Semiconductor Technology Co., Ltd., Qiming Photonics Technology Co., Ltd. and Peking University, and has been officially licensed by the Beijing Municipal Science and Technology Commission and the Zhongguancun Management Committee. The laboratory will focus on building a “device-chip-system-package” full-chain R&D system focusing on the three core technology directions of heterogeneous integrated silicon optical chips, on-chip intensive wave-division multiplexing, and silicon optical advanced packaging.
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