Citing unnamed supply chain sources, the media exclusively reported that TSMC plans to add five new advanced chip packaging plants to the Chiayi Science Park. According to the report, TSMC's P1 and P2 plants are expected to be put into mass production in 2027, while the P3, P4, and P5 plants under construction in Chiayi Science Park Phase II are also progressing simultaneously. After the completion of these five new plants, TSMC will have a total of 10 advanced chip packaging plants in Chiayi. The report indicated that the expansion plan will first be publicized for one month to solicit public comments, and then enter the feasibility study and environmental assessment stage.

Disclaimer:Webull uses external vendor Google Translation Service for news translations where we endeavour to ensure these are correct, however, we recommend that you please double-check this information accordingly. Webull is not responsible for translation errors or issues.