• LG Electronics showcased its “Chip-to-Chiller” AI server cooling portfolio at Data Center World Asia 2026 in Singapore on Sep. 29-30.
• Exhibit emphasized a bundled “One LG” data center infrastructure offer with LG CNS design-build-operate services, LG Energy Solution power systems.
• Highlighted prefabricated hydronic modules, air-cooled centrifugal chillers, liquid cooling systems to speed deployment, reduce upfront capex, support scaling.
• Noted its 1 MW, 2.6 MW, 600 kW coolant distribution units completed NVIDIA infrastructure qualification; 2.6 MW unit also DSX Ready.
• Introduced the Data Center Cooling Manager to optimize cooling operations using AI-based load prediction across CDUs, fan wall units, chillers.

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