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Orinno-backed Hongfucheng debuts on Shenzhen ChiNext board under ticker 301716
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Orinno-backed Hongfucheng debuts on Shenzhen ChiNext board under ticker 301716
  • Chengdu High-Tech Orinno Investment Group’s Ceyuan Capital-backed portfolio company Hongfucheng (301716) listed on Shenzhen’s ChiNext on Sept. 29.
  • Hongfucheng develops thermal-management materials, including graphene thermal pads, targeting AI data centers, autos, 5G, consumer electronics.
  • Orinno highlighted another ChiNext IPO at the same partner fund: CETC Siyi.
  • Hongfucheng reported 178 granted patents as of Dec. 2025, including 72 invention patents.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Chengdu High-Tech Orinno Investment Group Co Ltd published the original content used to generate this news brief on September 29, 2026, and is solely responsible for the information contained therein.

Disclaimer:This article represents the opinion of the author only. It does not represent the opinion of Webull, nor should it be viewed as an indication that Webull either agrees with or confirms the truthfulness or accuracy of the information. It should not be considered as investment advice from Webull or anyone else, nor should it be used as the basis of any investment decision.
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