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Gapwaves showcases MLW-based waveguide packaging for compact high-power amplifier modules at EuMW 2026
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Gapwaves showcases MLW-based waveguide packaging for compact high-power amplifier modules at EuMW 2026
  • Gapwaves unveiled a compact, waveguide-packaged high-power amplifier module built with its patented Multi-Layer Waveguide technology.
  • The copper waveguide structure targets lower signal losses with improved heat dissipation, supporting higher output in space- and weight-constrained platforms.
  • Gotmic integrated its MMIC power amplifier directly into the waveguide, delivering a thin module aimed at W-band 92–100 GHz systems.
  • Uses include airborne radar, telecom backhaul, future 6G networks, satellite communications, where thermal management is a key design constraint.
  • Hardware will be shown at European Microwave Week in London on Oct. 6–8, 2026.


Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Gapwaves AB published the original content used to generate this news brief on October 06, 2026, and is solely responsible for the information contained therein.

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