Sumitomo Bakelite will increase production of resin packaging materials used to protect advanced semiconductors. These advanced semiconductors are used in AI data centers, etc. The estimated investment amount is around 10 billion yen. The company will add additional production lines at its plants in Suzhou, China and Singapore, aiming to start production in 2030. Packaging materials are used in a post-process called “molding” in semiconductor manufacturing. The main function is to protect the chip from external impact, pollution, etc.

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