Zhitong Finance App News, Pudate Technology (00650) issued an announcement. As the company's various semiconductor equipment platforms continue to be delivered to customers and passed verification, the company has accumulated a large amount of mass production experience and received industry recognition, thus enabling the company to obtain formal orders in larger quantities. Since the announcement date, the company has received a total of 29 new equipment orders, 14 of which are new orders for semiconductor equipment, including single-chip cleaning equipment and furnace tube LPCVD equipment. These equipment systems are mainly used in customers' high-end specialty process semiconductors and third-generation semiconductor production lines. The process applications covering the front and back stages of the wafer are as follows, in order of number of machines:
1) OCTOPUS and OCTOPUS-SP single-chip cleaning equipment, used for 12-inch wafer backside cleaning, solvent cleaning, RCA cleaning and other processes, including four sulfuric acid cleaning equipment;
2) CUBE single-piece cleaning equipment for backside cleaning and etching processes; and
3) Furnace tube LPCVD equipment for 12-inch SiN film deposition process.
All of these equipment orders are official orders, and revenue has not yet been confirmed. The company will confirm the revenue after the customer has passed the verification.
Our self-developed semiconductor cleaning and furnace tube LPCVD/ALD equipment platforms can all cover mature processes and advanced logic and storage processes, and have the technical performance and industry-leading equipment productivity compared to leading international equipment manufacturers. Among them, the semiconductor cleaning equipment series platform uses single-chip cleaning equipment as the core platform, covering mainstream wet cleaning applications in the industry such as solvent cleaning, wafer back cleaning, and RCA cleaning. At the same time, the company further broke through technical barriers, developed 190℃ advanced high-temperature sulfuric acid cleaning equipment and successfully shipped it. Our semiconductor furnace tube equipment platform has two advanced equipment product lines, LPCVD and ALD, for key thin film deposition processes such as SiN, Poly, and TEOS for 12-inch wafers. Furthermore, the company has completed the development of low-K ALD SiOCN furnace tube equipment for high-performance dielectric layer film deposition at the 14/7nm node, and this segment is still dominated by overseas equipment vendors.
In the future, the company will continue to make full use of its technological advantages and actively expand the market, with a view to obtaining more batch formal orders and introducing more leading customers in the industry to promote the rapid growth of its semiconductor equipment business, increase the gross profit margin of the business, and promote the company's continuous organic development.